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3 in series CREE XP-L High-Intensity V2-1A LED 6500K-7000K on Sinkpad Copper 1938C

3 in series CREE XP-L High-Intensity V2-1A LED 6500K-7000K on Sinkpad Copper 1938C

Price:

$16.50

Brand:

CREE

Weight:

2.00 Grams

Shipping:

Free Shipping

Product Description

3 LED XPL High-Intensity V2-1A in Series

9-10.2V

Next Generation of XP-G Platform

The XLamp® XP-G3 LED is the highest efficacy and most reliable LED in the XP-G platform. Incorporating elements of Cree's SC5 Technology™ Platform, the XP-G3 LED delivers both high reliability at high operating temperatures and high efficacy to meet the higher efficacy and lumen maintenance requirements of DLC classification. Optimized for directional, high-lumen applications, from indoor and outdoor to portable and lamp retrofits, the XP-G3 LED delivers the benefits of the XP-G platform - compact and proven 3.45 mm x 3.45 mm package and established ecosystem, enabling customers to simplify the design process and shorten time to market.

Highest Efficacy Single-Die LED

The XLamp® XP-L LED is the first commercially available single-die LED to deliver breakthrough efficacy of up to 200 lm/w at 350 mA. The game-changing Cree® XLamp XP-L LED delivers an immediate performance increase of 50% or more as a drop-in upgrade for lighting designs based on Cree’s market-leading XLamp XP-G LEDs. As the brightest member of the industry’s only family of high-density-class discrete LEDs, the new XP-L LED redefines system performance, cost and size of LED lighting.

FEATURES

. Available in white, 70-CRI white, 80.CRI white, 85 CRI white and 90.CRI white
. ANSI.compatible chromaticity bins
. Binned at 85 ?C
. Maximum drive current: 3000 mA
. Low thermal resistance: 2.5 °C/W
. Wide viewing angle: 125?
. Unlimited floor life at . 30 oC/85% RH
. Reflow solderable - JEDEC J.STD.020C
. Electrically neutral thermal path
. RoHS.compliant

Size (mm x mm)	3.45 x 3.45
Maximum drive current (A)	3
Maximum power (W)	10
Light output	Up to 1079 lm @ 10 W, 85°C
Typical forward voltage (V)	2.95
Viewing angle (degrees)	125
Binning	85°C, ANSI
Thermal resistance (°C/W)	2.5
Reflow-solderable	Yes – JEDEC J-STD-020C-compatible
RoHS and REACH-compliant	Yes
UL-recognized component	Yes – Level 4 Enclosure Consideration